Accessories and Service for the Chip
To guarantee high performances of your systems, we do not only support you with personal expert advice, MEMS Foundry Service and design / fabrication of your individual microchips, but also with the suitable accessories and / or training.
Only with the aid of the accurate connection technique, periphery and surface modification the optimal integration of the microchips into your system can be realised. As we offer you the complete service from a single source, you do not have to be concerned about anything.
Accessory-Service at a Glance
For the optimal performance of your microsystems, not only the development and fabrication of perfect chips is of utmost importance, but the termination technique too. For microfluidics, the coupling of the chips at the periphery is realised with top or side connection directly affixed either using glue or molding.
The connection technique allows a stable integration of the chip in the microsystem. The sealing of capillaries to the chip via o-rings or ferrules prevents the leakage of fluids or gases.
Side Connections – Glued in or Welded on
With the option of side connections, the capillaries are directly stuck into the microchip channel. Gluing the capillaries has the advantage that depending on the selection of the glue an additional isolating layer can be created and that one can do without the chip holder.
In contrast to the adhesion method, the micro welding molds the capillaries onto the chip. Micronit applies a specific welding technique depending on the thermal energy of the materials of the connecting parts.
Particularly the side connections are extremely resilient against high pressure with the capacity to withstand over 400 bar. Especially for Liquid Chromatography Chips (short: LC-chips) this is essential as high pressure occur both when inserting the column material and when operating the chip. Additionally to the mechanical resilience against pressure, the aspect of the biocompatibility and the little dead volume are of high importance to the selection of the termination technique. When using glass capillaries biocompatible connections of microchips of glass and silicon to further peripheral appliances like pumps can be realized.
Wire Bonding & Other Connection Technologies
Besides chip holders and side connections using glued or molded capillaries, for example used for integrated optics, there are many methods of connection techniques. Adapted to the requirements of your chips, Micronit offers you the customized connection technology.
For electrical connections often wire binding is applied. Depending on the employed microchip the wire bonding process uses copper, gold or aluminium wires. Wire bonding generally offers the following advantages: high flexibility in the design, as well as the diversity in the combination of chip and substrate, high reliability and low mechanical and thermal strain.
With the aid of pumps fluids are transported through the chip.
Pumps are i.a. integrated in systems for DNA-analysis and for the manipulation of biological cells in the field of biotechnology and medical engineering. Additionally, micro pumps are applicable in chemistry and process engineering e.g. for flow chemistry or in laboratory and analytical techniques like blood analysis or sampling applications.
Micronit recommends pump manufacturers depending on the individual application requirements.
In the same way as pumps, valves are used in biotechnology, flow chemistry and medical engineering. Examples for the application are blood pressure gauges/ sphygmomanometers, or the dosage of fluids for bioreactors.
Micro valves are applied in industrial printing technique as well as in chemical and medical analysis systems like for instance in flow sensors. Valves are especially used to regulate resp. distribute gases and fluids precisely. The advantages of valves are, amongst others, a high chemical stability, the fast propulsion of fluids, the easy selection of the different sampling materials. Additionally, valves allow the fast switch between different materials resp. a simultaneous filling from diverse media.
Integration of Functional Coatings – f.i. Oxygen Sensors
Oxygen sensors are applicable in environmental technology, biotechnology, medical engineering and in thermal measurements. They are used for emission measurements or in systems for the regulation of the oxygen concentration. The sensors are applied too in measurements of flow velocities or thermal conductivity and in measurements of the energy balance of defined systems.
An in-situ measurement enables the measurement and conduction of processes within the chip at the same time.