Cleanroom Processes

Besides dry etching, wet etching, bonding, micropowder blasting, deposition and thin film deposition other clean room processes are applied as well to manufacture MEMS, NEMS, MOMS, BioMEMS, medical and microfluidic devices.

Micronit GmbH offers a broad range of various cleanroom processes. They are applied depending on the requirements set.

Lithography

The heart of the fabrication is the lithography. By means of lithographical processes the glass or silicon wafers are structured.  The transfer into the subjacent layers of metal, isolation or substrate is done after the lithography using dry etching, wet etching, micro powder blasting or the lift-off process. Depending on the size of the MEMS or microfluidic devices Micronit choses the optimal method.

  • Contact lithography
  • Nanoimprint lithography
  • Electrobeam lithography
  • Double-sided lithography
  • Coating on square substrates
  • Thick layer polymers as SU-8, BCB
  • Spin on glass
  • Spay coating
  • Lift-off technology

Galvanic Layers

Galvanic processes are used to supplement thin films. On top of a starting layer, applied using evaporation or sputtering a metallic reinforcement of the structures through a chemical deposition. Depending on the concrete application area Micronit chooses the suitable metal.

Metrology

  • Film stress measurement
  • Sheet resistance (four-point-probe)
  • SEM with CD-tool
  • EDX, TEM, X-Ray…
  • Ellipsometer
  • Interferometer
  • Inspection microscopes
  • Surface profilometer

Backend Processes

  • Automated or semi automated dicing of wafer and wafer stacks
  • CMP processes
  • Wire bonding

If you have any questions or requests, please call +49 (0) 231 88 68 077