Thin Film Techniques

Physical vapour deposition (PVD) is the general term describing a multitude of methods to deposit thin films on various surfaces.

These deposition methods comprise pure physical processes, such as vaporisation of the layer forming material in a vacuum or sputtering, whereby the material to be deposited is atomised through ion bombardment and transferred into the gaseous pase.

For microfluidic devices often Cr/Au, Ti/Pt or ITO is used, for MEMS or MOMS devices rather Al or TiW. Depending on the requirements Micronit deposits metals or dielectric materials.

Technical Details

Technical Details

  • Sputtering and evaporation
  • Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, SiO2, ITO, CuNi, etc
  • Thickness up to 2000 nm (depending on stress and adhesion)
  • Electroplating > 2 µm
  • Multi layers
  • Annealing (re-crystallisation, stress reduction and diffusion of alloys)

Applications

Applications

  • Thermistors
  • Electrodes for EC- and amperometric sensors
  • Capacitive electrodes / sensors
  • Coils
  • Thermopile sensors and modules
  • Mirrors
  • Magnetic sensors

Alternatively metals can be deposited by electroplating via a starting layer or conducting paths can be reinforced through electroplating. See also clean room processes.

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